As technology continues to advance and demand for more compact, lightweight, and innovative electronic devices grows, flex PCBs are expected to play an increasingly important role in the future. The unique characteristics of flex PCBs, including their adaptability, durability, and design versatility, make them well-suited for emerging trends and applications.
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| Type | Polyester(PET) | Adhesive Polymide | Adhesiveless Polymide |
| Flexibility (2mm radius) | Bad | Good | Best |
| Tear strength | 800g | 500g | 500g |
| Strip strength in the air | 1050N/M | 1750N/M | 1225N/M |
| Eatching>=20% | BEST | Bad | Good |
| Working temperature | 80 | 85~165 | 105~200 |
| Chip | Bad | Good | Best |
Ability in Process Technology
| Feature | Capability | ||
| Layer | 12-Jan | ||
| Board thickness (without stiffener) | 4‐40 mil | ||
| Tolerance of single layer | ±1.0mil | ||
| Tolerance of double‐layer (≤12mil) | ±1.2 mil | ||
| Tolerance of multi‐layer (≤12mil) | ±1.2 mil | ||
| Tolerance of multi‐layer (12mil‐32mil) | ±8% | ||
| Tolerance of board thickness (including PI stiffener) | ±10% | ||
| Min. board size | 0.0788” *0.1576” (without bridge) 0.3152” * 0.3152” (with bridge) | ||
| Max. board size | 8.668” * 27.5” | ||
| Impedance control tolerance | ±4Ω (≤50Ω), ±7% (>50Ω) | ||
| Min. coverlay bridge | 8 mil |
| Feature | Capability | ||
| Min. bend radius of single layer | 3‐6 times of board thickness | ||
| Min. bend radius of double‐layer | 7‐10 times of board thickness | ||
| Min. bend radius of multi‐layer | 10‐15 times of board thickness | ||
| Min. mechanical drill hole | 4 mil | ||
| Inner Layer Trace/ Space | 2/ 2 mil | ||
| Outer Layer Trace/ Space | 2/ 2 mil | ||
| Solder mask color | Green\Black | ||
| Surface treatment | HASL, ENIG, ENEPIG, Electrolytic Nickel Gold, Soft gold, Hard gold, Immersion silver and OSP, Immersion tin | ||
| Laser accuracy (Routing) | ±2 mil | ||
| Punching accuracy (Routing) | ±2 mil ‐ ±6 mil |
